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B760M DS3H AX/INTEL LGA1700/MATX/4x DDR5 up to 192GB/7600MHz/PCIe 4.0 x1 3.0 x1/M.2 x2

B760M DS3H AX/INTEL LGA1700/MATX/4x DDR5 up to 192GB/7600MHz/PCIe 4.0 x1 3.0 x1/M.2 x2

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B760M DS3H AX DDR4 (rev. 1.x)

Intel® B760 Chipset


Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors

Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution

Dual Channel DDR4:4*DIMMs XMP Memory Module Support

Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors

M.2 Thermal Guard:To Ensure M.2 SSD Performance

EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design

Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax

Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI

Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP

Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card


6+2+1 Phases Hybrid Digital VRM Design

• 6+2+1 Phases Low RDS(on) MOSFETs

• Premium Choke and Capacitors to improve transient response and minimize oscillation


GIGABYTE B760 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.


GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE otherboard


GIGABYTE PerfDrive

PerfDrive technology integrates multiple GIGABYTE exclusive BIOS settings to allow users to balance between different levels of performance, power consumption, and temperature according to their needs easily when using 13th gen Intel® Core™ processors.


GIGABYTE Ultra-Efficient M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.


Cooling Features

High Current Support

Each fan headers support PWM and DC fan and Water Cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection


Precision Control

Multiple temperature/fan speed control points for precise fan curve


Dual Curve Mode

Slope/Stair dual mode for different user scenario


Fan Stop

Fan can stop completely below users' specified temperature point


CONNECTIVITY

GIGABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage and Wi-Fi connectivity.


PERSONALIZATION

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.


Specifications
Audio Realtek® Audio CODEC, 2/4/5.1/7.1-channel
Chipset Intel® B760 Express Chipset
Form Factor Micro ATX; 24.4cm x 24.4cm
I/O Connectors 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 1 x addressable LED strip header 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x S/PDIF Out header 1 x Q-Flash Plus button 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper
Integrated CPU Graphics Integrated Graphics Processor-Intel® HD Graphics

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Product Product subtotal Quantity Price Product subtotal
B760M DS3H AX/INTEL LGA1700/MATX/4x DDR5 up to 192GB/7600MHz/PCIe 4.0 x1 3.0 x1/M.2 x2
B760M DS3H AX/INTEL LGA1700/MATX/4x DDR5 up to 192GB/7600MHz/PCIe 4.0 x1 3.0 x1/M.2 x2GA-B760M-DS3H AX@GIGA
B760M DS3H AX/INTEL LGA1700/MATX/4x DDR5 up to 192GB/7600MHz/PCIe 4.0 x1 3.0 x1/M.2 x2GA-B760M-DS3H AX@GIGA
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